e 3 rohs 2002/95/ec ds-cpc1998 - r01 www.clare.com 1 characteristics features ? load current up to 20a rms with 5c/w heat sink ? 800v p blocking voltage ? 5ma control current ? zero-cross switching ? 2500v rms isolation, input to output ? dc control, ac output ? optically isolated ? ttl and cmos compatible ? low emi and rfi generation ? high noise immunity ? machine insertable, wave solderable applications ? programmable control ? process control ? power control panels ? remote switching ? gas pump electronics ? contactors ? large relays ? solenoids ? motors ? heaters approvals ? ul 508 recognized component: file e69938 description CPC1998J is an ac solid state switch utilizing dual power scr outputs. this device also includes zero-cross turn-on circuitr y and is specified with an 800v p blocking voltage. tightly controlled zero-cross circuitry ensures low noise switching of ac loads by minimizing the generation of transients. the optically coupled input and output circuits provide ex ceptional noise immunity and 2500v rms of isolation between the control and the output. as a result, the cpc1998 is well suited for industrial environments where electromagnetic interference would disrupt the operation of plant facility communications and control systems. the unique i4-pac package pioneered by ixys allows solid state relays to achieve the highest load current and power ratings. this package features a unique ixys process in which the silicon chips are soft soldered onto the direct copper bond (dcb) substrate instead of the traditional copper leadframe. the dcb ceramic, the same substrate used in high power modules, not only provides 2500v rms isolation but also very low thermal resistance (0.35 c/w). ordering information pin configuration parameter rating units ac operating voltage 20-240 v rms load current with 5c/w heat sink 20 a rms no heat sink 5 on-state voltage drop 1.1 v p (at i l =2a p ) blocking voltage 800 v p r jc 0.35 c/w part description CPC1998J i4-pac package (25 per tube) 2 1 ? led + led ac load 4 3 zc cpc1998 ac power switch
r01 www.clare.com 2 cpc1998 1 .specifications 1.1 absolute maximum ratings @ 25c 1 derate linearly 1.33mw / c. 2 free air, no heat sink. absolute maximum ratings are stress ratings. stresses in excess of these ratings can cause permanent damage to the device. functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. 1.2 electrical characteristics @ 25c 1 tested at a peak value equivalent. 2 zero-cross first half-cycle @ < 100hz. 3 snubber circuits may be re quired at low power factors. 4 for high-noise environments, or high-frequency operation (> 60hz), or for applications with a high inductive load, use i f 10ma. symbol min max units blocking voltage - 800 v p reverse input voltage - 5 v input control current - 50 ma peak (10ms) - 1 a input power dissipation 1 -150 mw total power dissipation 2 -3.5 w i 2 t for fusing (1/2 sine wave, 60hz) -200 a 2 s isolation voltage, input to output - 2500 v rms esd, human body model - 8 kv operational temperature - 40 +85 c storage temperature - 40 +125 c parameter conditions symbol minimum typical maximum units output characteristics load current continuous no heat sink, v l =20-240v rms i l 0.1 - 5 a rms continuous t c =25c 0.1 - 50 maximum surge current 1/2 sine wave, 60hz i p --150a off-state leakage current v l =800v i leak --100 a p on-state voltage drop 1 i l =2a p - -0.851.1 v p off-state dv/dt i f =0ma dv/dt 1000 - - v/ s switching speeds tu r n - o n i f =5ma t on --0.5 cycles tu r n - o f f t off --0.5 zero-cross turn-on voltage 1 st half-cycle - -520 v subsequent half-cycle ---5 holding current - i h -4450ma latching current - i l -4875ma operating frequency 2 - -20-500hz load power factor for guaranteed turn-on 3 f=60hz pf 0.25 - - - input characteristics input control current 4 i l =1a resistive, f=60hz i f --5ma input dropout voltage - -0.8- -v input voltage drop i f =5ma v f 0.9 1.2 1.4 v reverse input current v r =5v i r --10 a input/output characteristics capacitance, input-to-output - c i/o --3pf
preliminary 3 www.clare.com r01 cpc1998 2 thermal characteristics 2.1 thermal management device high current characterization was performed using kunze heat sink ku 1-159, phase change thermal interface material ku-alc 5, and transistor clip ku 4-499/1. this combination provided an approximate junction-to-ambient thermal resistance of 12.5c/w. 2.2 heat sink calculation higher load currents are possible by using lower thermal re sistance heat sink combinations. 2.3 thermal performance data parameter conditions symbol minimum typical maximum units thermal resistance (junction to case) - r jc - - 0.35 c/w thermal resistance (junction to ambient) free air r ja -33-c/w junction temperature (operating) - t j -40 - 125 c r ca = - r jc (t j - t a ) p d t j = j u nction temperat u re (c), t j 125c * t a = am b ient temperat u re (c) r jc = thermal resistance, j u nction to case (c/ w ) = 0.35c/ w r ca = thermal resistance of heat sink & thermal interface material , case to am b ient (c/ w ) p d = on-state v oltage ( v rms ) ? load c u rrent (a rms ) * ele v ated j u nction temperat u re red u ces semicond u ctor lifetime. heat sink ratin g load current (a rms ) 0 5 10 15 20 25 30 35 40 output power (w) 0 5 10 15 20 25 30 35 40 output power vs. load current temperature (oc) 0 25 50 75 100 125 output power (w) 0 5 10 15 20 25 30 35 40 output power vs. ambient temperature heat sink 1oc/ w 2oc/ w 5oc/ w 10oc/ w 15oc/ w free air
r01 www.clare.com 4 cpc1998 3 performance data* * the performance data shown in the graphs above is typical of device performance. for guaranteed parameters not indicated in the written specifications, please cont act our application department. led forward volta g e (v) 1.25 1.26 1.27 1.2 8 1.29 1.30 device count (n) 0 5 10 15 20 25 30 35 typical led forward volta g e drop (n=50, i f =5ma, t a =25oc) led forward current (ma) 2.66 2.70 2.74 2.7 8 2. 8 22. 8 6 2.90 device count (n) 0 5 10 15 20 25 typical i f for switch operation with 1a resistive load (n=50, v l =120v ac /60hz, t a =25oc) forward volta g e drop (v) 0. 8 56 0. 8 59 0. 8 62 0. 8 65 0. 8 6 8 0. 8 71 0. 8 74 device count (n) 0 5 10 15 20 25 forward volta g e drop distribution (n=50, i f =5ma, i l =2a, t a =25oc) zero-cross volta g e (v) 6.2 6.4 6.6 6. 8 7.0 7.2 7.4 device count (n) 0 5 10 15 20 zero-cross volta g e (n=50, i f =5ma, t a =25oc) blockin g volta g e (v p ) 8 74 8 76 8 7 888 0 88 2 88 4 88 6 device count (n) 0 5 10 15 20 typical blockin g volta g e distribution (n=50, t a =25oc) temperature (oc) -40-200 204060 8 0 100 led forward volta g e (v) 1.1 1.2 1.3 1.4 1.5 1.6 typical led forward volta g e drop vs. temperature i f =50ma i f =20ma i f =10ma i f =5ma temperature (oc) -40-200 204060 8 0 100 led forward current (ma) 2.5 3.0 3.5 4.0 4.5 led forward current to operate vs. temperature - resistive load (i l =1a, f l =60hz) temperature (oc) -40-200 204060 8 0 100 led forward current (ma) 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5 led forward current to operate vs. temperature - inductive load (i l =500ma, f l =60hz, l l =400mh) load frequency (hz) 0 100 200 300 400 500 600 led forward current (ma) 2.5 3.0 3.5 4.0 4.5 5.0 led current to operate vs. load frequency - resistive load (v p =71v, r l =10 , i l =7a, t a =25oc) load frequency (hz) 0 100 200 300 400 500 600 led forward current (ma) 4. 8 5 4.90 4.95 5.00 5.05 5.10 5.15 5.20 led current to operate vs. load frequency - inductive load (v l =200v, z l =400mh/220 , t a =25oc) load frequency (hz) 0 100 200 300 400 500 600 led forward current (ma) 5.10 5.12 5.14 5.16 5.1 8 5.20 led current to operate vs. load frequency- inductive load (v l =200v, z l =196mh/110 , t a =25oc)
preliminary 5 www.clare.com r01 cpc1998 * the performance data shown in the graphs above is typical of device performance. for guaranteed parameters not indicated in the written specifications, please cont act our application department. temperature (oc) -40-200 204060 8 0 100 zero-cross volta g e (v) 6.0 6.2 6.4 6.6 6. 8 7.0 7.2 7.4 zero-cross volta g e vs. temperature (i f =5ma, r l =120 ) volta g e (v) -1.5 -1.0 -0.5 0.0 0.5 1.0 1.5 current (a) -15 -10 -5 0 5 10 15 output volta g e vs. output current (i f =5ma) t a =-40 o c t a =25 o c t a = 8 5 o c temperature (oc) -40-200 204060 8 0100 v on (v) 0.70 0.75 0. 8 0 0. 8 5 0.90 0.95 1.00 1.05 1.10 v on vs. temperature i l =3a i l =2a i l =1a i l =10a i l =5a temperature (oc) -40-200 204060 8 0 100 holdin g current (ma) 20 30 40 50 60 70 8 0 holdin g current vs. temperature (r l =1.9 ) temperature (oc) 0 10203040506070 8 0 90 100 thermal resistance (oc/w) 0 5 10 15 20 25 30 total heat sinkin g required vs. temperature i l =5a rms i l =7.5a rms i l =10a rms i l =15a rms i l =20a rms temperature (oc) -40-200 204060 8 0100 breakdown volta g e (v) 8 00 8 50 900 950 1000 breakdown volta g e vs. temperature (i f =0ma) temperature (oc) -40 -20 0 20 40 60 8 0 100 leaka g e current ( a) 0.001 0.01 0.1 1 10 100 leaka g e current vs. temperature measured across pins 1&2 v l = 8 00 v v l =600 v v l =400 v time 100 s 1ms 10ms 100ms 1s 10s current (a) maximum sur g e current non-repetitive, free air 1 10 100 1000
r01 www.clare.com 6 cpc1998 4 manufacturing information 4.1 moisture sensitivity all plastic encapsulated se miconductor packages are susceptible to moisture ingression. clare classified all of its plastic encapsulated device s for moisture sensitivity according to the latest version of the joint industry standard, ipc/jedec j-std-020 , in force at the time of product evaluation. we test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and informat ion in that standard as well as to any limitations set forth in the information or standards referenced below. failure to adhere to the warnings or limitations as establ ished by the listed specificati ons could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. this product carries a moisture sensitivity level (msl) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard ipc/jedec j-std-033 . 4.2 esd sensitivity this product is esd sensitive , and should be handled according to the industry standard jesd-625 . 4.3 reflow profile this product has a maximum body temperature and time rating as shown below. all other guidelines of j-std-020 must be observed. 4.4 board wash clare recommends the use of no-clean flux formulations. however, board washing to remove flux residue is acceptable. since clare employs the use of silicone coating as an optical wavegui de in many of its optically isolated products, the use of a short drying bake could be necessary if a wash is used after solder reflow processes. chlorine-based or fluorine-based solvents or fluxes shoul d not be used. cleaning methods that employ ultrasonic energy should not be used. device moisture sensitivity level (msl) rating CPC1998J msl 1 device maximum temperature x time CPC1998J 245c for 30 seconds e 3 rohs 2002/95/ec
preliminary 7 www.clare.com r01 cpc1998 4.5 mechanical dimensions isolated heat sink 1.270 typ (0.050 typ) n ote: back-side heat sink meets 2500 v rms isolation to the pins. 20. 8 79 0.254 (0. 8 22 0.010) 20.396 0.50 8 (0. 8 03 0.020) 15.240 0.50 8 (0.600 0.020) 3. 8 10 0.254 (0.150 0.010) 2.362 0.3 8 1 (0.093 0.015) 19.914 0.254 (0.7 8 4 0.010) 5.029 0.127 (0.19 8 0.005) 1.1 8 1 0.076 (0.047 0.003) 15.317 0.254 (0.603 0.010) 1.930 0.3 8 1 (0.076 0.015) 17.221 0.254 (0.67 8 0.010) dime n sio n s mm (inches) 0.635 0.076 (0.025 0.003) 2.794 0.127 (0.110 0.005) for additional information please vi sit our website at: www.clare.com clare, inc. makes no representations or warranties with respect to the accuracy or completeness of the contents of this publica tion and reserves the right to make changes to specifications and product descriptions at any time without notice. neither circuit patent licenses nor indemnity are expressed or implied. except as set forth in clare?s standard terms and conditions of sale, clare, inc. assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. the products described in this document are not designed, intended, authorized or warranted for use as components in systems in tended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of clare?s product may result in direct physical harm, i njury, or death to a person or severe property or environmental damage. clare, inc. reserves the right to discontinue or ma ke changes to its products at any time without notice. specification: ds-cpc1998-r01 ?copyright 2010, clare, inc. all rights reserved. printed in usa. 11/30/2010
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